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Pasta Térmica HY 510 fotoresistencia IRrecv irrecv(RECV_PIN) 7818 IRrecv irrecv(RECV_PIN) ahorro de energía Al aplicarla entre uniones mecánicas permite cubrir las imperfecciones de ambas superficies aumentando la superficie de contacto y disminuyendo la resistencia térmica del conjunto La pasta refrigerante permite mejorar la transferencia térmica entre semiconductores
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